2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set

$49.90
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Description

2UUL BH17 CPU Reball Base – Magnetic Dual-Sided Reballing Platform Set
Professional dual-sided magnetic base designed for precise CPU and BGA IC reballing in mobile device repair.

Features

  • Dual-Sided Efficiency Design
    Two working surfaces support multiple reballing steps or chip types, helping technicians work faster and more efficiently.
  • Stable Magnetic Fixation
    Integrated strong magnets securely hold CPUs and IC chips in place, reducing alignment errors during stencil positioning and reflow.
  • High-Temperature, Workshop-Ready Build
    Manufactured from heat-resistant precision metal, designed to withstand continuous hot-air rework in professional repair environments.
  • Precision Reballing Support
    Ensures accurate chip positioning and consistent solder ball formation — essential for high-success-rate motherboard repair.
  • Compact & Professional Tooling
    Bench-friendly size, durable construction, and easy integration into any chip-level repair setup.


Applications

Phone Motherboard Repair
Ideal for CPU reballing on iPhone and Android devices during advanced logic board repair.

BGA & IC Rework Applications
Provides stable support for solder paste printing, stencil alignment, and reballing processes.

Repair Shops & Refurbishment Lines
A reliable tool for technicians handling daily, high-volume chip-level repairs.

Training & Technical Education
Recommended by Study Repair for technicians developing professional BGA reballing skills.

 

Suitable Models

 

Below stencils are included:

for iPhone (12pcs)

  • A19 Pro
  • A19
  • A18 Pro
  • A18
  • A17
  • A16
  • A15
  • A14
  • A13
  • A12
  • A11
  • A10

Exynos (11pcs)

  • Exynos2200 (猎户座2200)
  • Exynos2100 (猎户座2100)
  • Exynos9820 (猎户座9820)
  • Exynos980 (猎户座980)
  • Exynos 8895 (猎户座8895)
  • Exynos 1480-E8845
  • Exynos 1330-E8535P
  • Exynos 990 (猎户座990)
  • Exynos 1380-E8835P
  • Exynos 1280-E8825
  • Exyn0s 9815/1080 (猎户座9815/1080)

Qualcomm (17pcs)

  • SM8750 (骁龙8至尊版)
  • SM8550 (骁龙8Gen2)
  • SM8450 (骁龙8Gen1)
  • SM7150 (骁龙730G)
  • SM8150 (骁龙855)
  • SM7450 (骁龙7Gen1)
  • SM7325 (骁龙778G)
  • SM8475/SM7475 (骁龙8+/7+Gen2)
  • SM7125 (骁龙720G)
  • SM8250-102 (骁龙8Gen2)
  • SM8650 (骁龙8Gen3)
  • SM7350 (骁龙778/775)
  • SM8350 (骁龙888/888Plus)
  • SM8250-002大 (骁龙865大/870大)
  • SM7550 (骁龙7Gen3)
  • SM7225-00AB (骁龙7506)
  • SM7250 (骁龙765G)

MTK (14pcs)

  • MT6989W (天玑9300)
  • MT6985W (天玑9200)
  • MT6895Z (天玑8100)
  • MT6897Z (天玑8300UItra)
  • MT6855V (天玑玑930)
  • MT6877V (天玑900)
  • MT6853V (天玑720)
  • MT8781/MT6789V
  • MT6983Z (天玑9000)
  • MT6761V/6762V/6765
  • MT6885Z (天玑1300)
  • MT6833V (天玑810)
  • MT6873V/6875V (天玑80C/820)
  • MT6891Z/6893Z (天玑1100/12000)

 

 



HiSilicon (9pcs)

  • Hi36C0 (海思麒麟9020)
  • Hi36A0 (海思麒鳞900s)
  • Hi3690-5G (海思麒鳞990-5G)
  • Hi3690-4G (海思麒鳞990-4G)
  • Hi3690-5G (海思麒麟990-5G)
  • Hi3680 (海思麒麟980)
  • Hi6280 (海思麒鱗810)
  • Hi6290/L (海思麒麟985/820)
  • Hi36A0 (海思麒麟9000)
  • Hi3670 (海思麒麟970)

 

 

 

EMMC + RMA (12pcs)

  • EMMC
    • BGA 254 Small  (EMMC)
    • BGA186 (EMMC)
    • BGA 178 Small (EMMC)
    • BGA169 (EMMC)
    • BGA 162 (EMMC)
    • BGA153 (EMMC)
    • BGA 134 (EMMC)
  • CPU RAM
    • BGA 556 (CPU RAM Layer)
    • BGA496 (CPU RAM Layer)
    • BGA436 (CPU RAM Layer)
    • BGA 376 (CPU RAM Layer)
    • BGA 221 (CPU RAM Layer)


 

Specifications

  • Carton Box packing
  • Size & Weight
    • Product Size: 64.5*64.5*34.5mm
    • N.W.: 266g

Hassle-free contact

We're here to help! Contact us at sales@isupplyparts.com