2UUL BH17 CPU Reball Base – Magnetic Dual-Sided Reballing Platform Set
Professional dual-sided magnetic base designed for precise CPU and BGA IC reballing in mobile device repair.
Features
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Dual-Sided Efficiency Design
Two working surfaces support multiple reballing steps or chip types, helping technicians work faster and more efficiently. -
Stable Magnetic Fixation
Integrated strong magnets securely hold CPUs and IC chips in place, reducing alignment errors during stencil positioning and reflow. -
High-Temperature, Workshop-Ready Build
Manufactured from heat-resistant precision metal, designed to withstand continuous hot-air rework in professional repair environments. -
Precision Reballing Support
Ensures accurate chip positioning and consistent solder ball formation — essential for high-success-rate motherboard repair. -
Compact & Professional Tooling
Bench-friendly size, durable construction, and easy integration into any chip-level repair setup.
Applications
✔ Phone Motherboard Repair
Ideal for CPU reballing on iPhone and Android devices during advanced logic board repair.
✔ BGA & IC Rework Applications
Provides stable support for solder paste printing, stencil alignment, and reballing processes.
✔ Repair Shops & Refurbishment Lines
A reliable tool for technicians handling daily, high-volume chip-level repairs.
✔ Training & Technical Education
Recommended by Study Repair for technicians developing professional BGA reballing skills.
Suitable Models
Below stencils are included:
for iPhone (12pcs)
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Exynos (11pcs)
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Qualcomm (17pcs)
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MTK (14pcs)
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HiSilicon (9pcs)
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EMMC + RMA (12pcs)
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Specifications
- Carton Box packing
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Size & Weight
- Product Size: 64.5*64.5*34.5mm
- N.W.: 266g
Hassle-free contact
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