2UUL BS148 / BS183 Black Skull Solder Paste for PCB Repair 50g
The 2UUL Black Skull Solder Paste (BS148 for 148℃, BS183 for 183℃) is a professional high-precision solder paste designed for PCB repair, BGA reballing, and microelectronics rework. Formulated with gold-density tin powder, it delivers exceptional wetting, strong oxidation resistance, and zero-bubble solder joints. Available in low-temperature 148℃ and standard 183℃ versions, this 50g jar is ideal for professional repair workshops and technicians.
Features
⚡ Two Melting Point Options: BS148 melts at 148℃ (low-temperature, protects heat-sensitive components); BS183 melts at 183℃ (standard eutectic, for general precision soldering).
🔥 Gold-Density Tin Powder: Premium alloy powder with uniform particle size (20-38μm), ensuring super-plump, zero-bubble solder joints and reliable conductivityAlibaba.co....
🛡️ Strong Deoxidation & Wetting: Quickly removes pad oxides and contaminants; molten solder spreads evenly, eliminating cold joints, dry joints, and virtual solderingعلي ب....
✨ Smooth & Stable Texture: Creamy, non-separating formula; no dripping or bleeding during reflow, perfect for stencil printing and manual application on dense components.
🌫️ Low Smoke & Low Residue: Produces minimal fumes during heating; residual flux is clear and easy to clean, no corrosion to PCB or delicate partsعلي ب....
📦 50g Large Capacity: Generous 50g black skull jar with airtight lid, easy storage, long shelf life, and cost-effective for daily high-volume repairs.
🎨 Black Skull Gold Label Design: Iconic black jar with gold label for easy identification; high contrast aids precise application and inspectionعلي ب....
Use Guide
Preparation
Power off the device completely. Clean the PCB area to remove dust, old solder, and oxides; ensure the surface is dry and free of grease.
Application Steps
Stir the solder paste gently before use to ensure uniformity.
Apply a thin, even layer onto pads, BGA chips, or stencils using a scraper or squeegee.
Reflow with hot air station (148℃ for BS148, 183℃ for BS183) until solder melts and forms bright joints.
Clean residual flux with cleaning agent if needed.
Usage Tips
Do not over-apply to avoid bridging.
Seal tightly after use and store in a cool, dry place (10-25℃), away from direct sunlight and moisture.
Stir thoroughly if paste separates after long storage.
Applications
Mobile Phone Repair
Ideal for BGA reballing, CPU/Baseband chip soldering, motherboard rework, and FPC connector repair on iPhone and Android devices.
Laptop & Tablet Maintenance
Perfect for GPU/CPU reflow, QFN/QFP component replacement, and multi-layer PCB repair on laptops and tablets.
Precision Electronic Soldering
Suitable for SMD components, power ICs, memory chips, and other micro heat-sensitive parts requiring low-temperature or standard soldering.
Professional Workshop Supplies
Essential high-grade solder paste for chip-level repair technicians, BGA rework stations, and professional electronics repair stores.
