The 2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades are professional precision blades designed for smartphone motherboard repair, CPU rework, and underfill adhesive removal. Featuring a flat cutting edge and high-precision blade design, they help technicians quickly and safely remove stubborn glue residue, underfill adhesive, and solder pad contaminants during micro repair operations.
Designed for professional repair environments, the DA28 FlatCut blades provide excellent control and cutting accuracy while minimizing the risk of damaging PCB pads and surrounding components. The 5-piece box packaging offers convenient storage and reliable replacement support for daily repair work.
◆ Key Features
✔ FlatCut Precision Blade Design
Features a flat cutting edge that provides stable contact with the working surface, making it easier to remove underfill glue and adhesive residue with controlled movements.
✔ Fast Underfill Glue Removal
Designed to efficiently remove:
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CPU underfill glue
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IC adhesive residue
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Solder pad contaminants
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PCB surface glue buildup
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Excess adhesive after chip removal
✔ High-Precision Blade Edge
The sharp and durable blade edge allows accurate scraping and cleaning while maintaining better control during delicate motherboard repair.
✔ PCB Protection Design
The flat blade structure helps reduce accidental damage to solder pads and nearby components when used correctly.
✔ Professional Micro Repair Tool
Ideal for:
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CPU reballing preparation
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BGA IC repair
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Motherboard maintenance
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Solder pad cleaning
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Chip replacement preparation
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Smartphone logic board repair
✔ Convenient 5PCS Packaging
Includes 5 replacement blades stored in a compact box, making it easy to organize and replace blades during frequent repair operations.
◆ How to Use
Step 1: Prepare the Repair Area
Clean the motherboard surface and secure the device or PCB before starting the glue removal process.
Step 2: Select and Install the Blade
Install the DA28 FlatCut blade onto a compatible precision handle if required.
Step 3: Remove Underfill Glue Carefully
Hold the blade at an appropriate angle and gently scrape away adhesive residue with controlled pressure.
Step 4: Clean the Solder Pad Area
Remove remaining glue particles and inspect the surface under magnification.
Step 5: Prepare for Rework
Ensure the solder pads are clean and ready for soldering, reballing, or component replacement.
◆ Maintenance Tips
✔ Clean After Each Use
Remove glue residue, solder particles, and debris from the blade surface after every repair.
✔ Avoid Excessive Force
Apply controlled pressure to prevent damage to PCB pads and maintain blade sharpness.
✔ Replace Worn Blades
Use a new blade when cutting performance decreases to ensure clean and efficient removal.
✔ Store Properly
Keep unused blades inside the storage box and store in a dry environment.
◆ Specifications
| Item | Details |
|---|---|
| Brand | 2UUL |
| Model | DA28 |
| Product Name | FlatCut Solder Pad Underfill Glue Fast Removal Blades |
| Blade Type | FlatCut Precision Blade |
| Quantity | 5PCS / Box |
| Material | High-Strength Steel |
| Application | PCB, BGA & Smartphone Motherboard Repair |
◆ Package Includes
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5 × 2UUL DA28 FlatCut Solder Pad Underfill Glue Removal Blades
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1 × Storage Box
The 2UUL DA28 FlatCut Blades are an essential consumable tool for professional repair technicians working on advanced motherboard and BGA repair. With their precision flat-cut design and efficient glue removal performance, they help improve repair accuracy and workflow efficiency during delicate electronic restoration tasks.
◆ Hassle-Free Contact
We're here to help! If you have any questions about this product, need technical assistance, or require support with your order, feel free to contact our team.
Email: sales@isupplyparts.com
We are committed to providing professional support and a smooth shopping experience for all repair technicians and customers.
