The 2UUL JOINT X Solder Paste includes three versions with melting points of 158℃, 183℃ and 200℃ respectively. This professional solder paste is specially developed for PCB precision repair, BGA chip reballing and various micro soldering tasks. It features outstanding wetting performance, stable texture and reliable soldering effect. With a 50g portable package, it is a versatile essential consumable for electronic repair technicians.

⚡ Three Melting Point Options: FS158 (158℃ low temperature) protects heat-sensitive components; FS183 (183℃ standard temperature) fits most common soldering work; FS200 (200℃ high temperature) delivers firm soldering for components requiring high temperature resistance.

🛡️ Powerful Deoxidation & Excellent Wetting: Effectively removes oxide layers and dirt on solder pads. The solder spreads evenly to form full and solid joints, avoiding cold soldering, virtual soldering and poor tinning.

🧴 Uniform & Stable Texture: Premium paste formula won’t separate, drip or flow randomly. It adapts to manual coating and stencil printing, ideal for dense and tiny component areas.

✨ Low Residue & Easy Cleaning: Leaves slight harmless residues after reflow. Simple cleaning is available to keep PCB boards and components intact.

🌫️ Low Smoke & Odorless: Generates nearly no irritating smoke or strange smell during heating, creating a comfortable working environment for long-time operation.

📦 50g Practical Pack: Moderate net weight with sealed packaging, easy to store and carry. Suitable for personal use and daily mass repair in workshops.

Cut off all power of the device thoroughly. Clean dust, old solder and impurities on the PCB soldering area, and keep the surface dry and clean.

Stir the solder paste evenly before use. Apply an appropriate amount uniformly on target solder pads, BGA chips or welding positions. Conduct hot air reflow according to the corresponding melting point until complete solder joints are formed.

Avoid excessive application to prevent solder bridging. Seal the container tightly after each use. Store in a cool and dry place, away from high temperature, direct sunlight and moisture.

Perfect for BGA reballing, motherboard rework, soldering of CPU, baseband chips, connectors and FPC cables on all smartphones.

Great for chip replacement, solder joint rework and multi-layer PCB repair of laptops, tablets and other portable smart devices.

Applicable for SMD parts, power ICs, memory chips and other micro components with different temperature requirements.

Multi-purpose soldering auxiliary material for chip-level repair technicians and professional electronic maintenance stores.