The 2UUL PB01 PadBall Solder Balls are professional tiny solder balls specially designed for iPhone solder pad repair, pad reconnection and PCB trace rework. With uniform size, great ductility and stable melting performance, they can effectively repair lifted, broken or missing solder pads on motherboards. It is a dedicated essential consumable for mobile phone chip-level maintenance.

⚡ Specially Designed for iPhone Repair: Optimized for iPhone motherboard solder pad restoration, perfectly matching the size and spacing of tiny pads on Apple devices.

🔍 Uniform Size & Round Shape: Each solder ball is consistent in diameter and shape, ensuring neat arrangement and accurate positioning during rework.

🛡️ Excellent Melting & Adhesion: Good fluidity after melting, firmly bonds with PCB pads and traces. Effectively fixes lifted, damaged and missing pads for stable connection.

✨ High Purity Alloy Material: Adopts high-quality alloy, features great conductivity and oxidation resistance, prevents poor contact after repair and extends service life.

🧩 Easy Operation & High Yield: Flexible and easy to manipulate, suitable for manual placement and hot air reflow. Simple to use even for intricate pad repair work.

🌫️ Low Smoke During Heating: Produces little irritating smoke while working, keeping a comfortable operating environment.

Power off the device completely. Clean the damaged solder pad area, remove old solder, oxide and dirt, and make sure the surface is dry.

Place appropriate solder balls one by one on the repaired pads. Adjust the hot air temperature and wind speed reasonably for reflow. Wait until the solder balls melt and form complete, firm pads, then stop heating.

Control the heating time and temperature to avoid scalding surrounding components and PCB traces. Keep the product sealed and stored in a cool dry place, away from moisture and high temperature. Prevent the solder balls from mixing with other specifications.

Mainly used for repairing lifted, broken, missing solder pads and broken traces on iPhone mainboards, including CPU, baseband, connector and BGA pad rework.

Applicable for solder pad restoration of various smartphone motherboards and precision circuit board maintenance.

Ideal for tiny pad repair, fine trace connection and other delicate rework on compact electronic components.

Specialized repair consumables for professional mobile phone technicians and electronic maintenance stores.