The 2UUL PB02 PadBall Solder Balls are professional micro solder balls engineered exclusively for Android device solder pad restoration and PCB rework. Featuring uniform dimension, reliable ductility and stable melting property, they are ideal for fixing lifted, cracked or missing solder pads on mainboards. This practical consumable is a must-have for chip-level Android phone repair.

⚡ Customized for Android Devices: Tailored to match the size and pitch of solder pads on Android motherboards, perfectly fits various mainstream Android smartphones.

🔍 Uniform Round Shape & Size: Every solder ball is precisely sized and evenly shaped, enabling neat layout and accurate positioning during rework.

🛡️ Superior Melting & Adhesion Performance: Melts smoothly with great fluidity, tightly adheres to PCB pads and circuits to restore stable electrical connection.

✨ High-Purity Alloy Material: Made of premium alloy with excellent conductivity and anti-oxidation ability, effectively avoiding poor contact and ensuring long-term repair stability.

🧩 User-Friendly & High Success Rate: Easy to pick and place manually, compatible with hot air reflow. Works well even for complex dense pad repair.

🌫️ Low Smoke Emission: Generates minimal fumes during heating, maintaining a clean and comfortable working environment.

Fully power off the device. Thoroughly clean the damaged pad area to remove old solder, oxides and debris, and keep the surface dry.

Place solder balls accurately onto the target pads. Set proper temperature and wind speed for hot air reflow. Stop heating once the solder balls melt and form complete, firm solder pads.

Strictly control heating time and temperature to prevent damage to nearby components and circuit traces. Seal tightly after use and store in a cool dry place, away from moisture and high heat. Do not mix with solder balls of other specifications.

Primarily used to repair lifted, broken and missing solder pads as well as damaged traces on Android mainboards, including CPU, baseband, connectors and BGA pad rework.

Suitable for solder pad recovery and maintenance on all kinds of Android mobile phone circuit boards.

Perfect for tiny pad repair and fine circuit connection on compact micro electronic components.

Dedicated repair consumables for professional maintenance technicians and electronics repair stores.