CNC Donor Board Without NAND for iPhone 11 Repair

$14.69
SKU: IP91001

Type: Upper Layer (Without NAND)

Upper Layer (Without NAND)
Lower Layer - US Version
Lower Layer - EU Version
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Description

Product Description

The CNC Donor Board Without NAND for iPhone 11 is designed for professional motherboard repair, PCB reconstruction, and advanced data recovery applications. This precision-machined donor board provides a suitable PCB platform for technicians working on severely damaged iPhone 11 motherboards where conventional repair methods are not sufficient.

The board is supplied without NAND, allowing technicians to transfer the required original components from the customer's damaged motherboard for advanced repair and data recovery work.


Key Features

Feature Details
CNC Precision Machining Accurately machined for professional iPhone 11 motherboard repair
Without NAND Supplied without NAND for original NAND transplantation when required
Data Recovery Support Suitable for advanced motherboard reconstruction and data recovery applications
PCB Reconstruction Helps repair severe PCB damage, including traces, pads, vias, and board layers
Component Transplantation Designed for transferring required original components from a damaged motherboard
Professional Repair Suitable for experienced technicians performing chip-level and board-level repairs


Common Applications

Application Purpose
iPhone 11 Motherboard Repair Provides a donor PCB platform for advanced board-level repair
Data Recovery Supports reconstruction of the original board environment for data recovery
PCB Layer Repair Helps restore severely damaged PCB layers and connections
Trace & Via Reconstruction Suitable for repairing damaged traces, pads, and vias
Component Transplantation Allows technicians to transfer required original components
NAND-Related Repair Supplied without NAND for advanced original NAND transplantation work
Repair Training Useful for professional motherboard repair practice and training


Repair Notes

This donor board is provided without NAND. For data recovery applications, the relevant original components from the customer's motherboard must be preserved and properly transferred according to the specific repair case.

Professional microsoldering equipment, CNC machining tools, microscope inspection, and advanced motherboard repair skills are recommended. Compatibility should be confirmed before starting the repair.


Important

This is a professional repair component, not a complete replacement motherboard. It is intended for experienced technicians familiar with iPhone motherboard architecture, component transplantation, and PCB-level repair.

⚠️Tested and fully inspected before shipping. No returns or exchanges will be accepted after glue removal or solder removal.


Compatibility

Compatible with: iPhone 11


Easy Contact & Support

We're always happy to help.

If you have any questions about this product, compatibility, installation, or repair, feel free to contact us at sales@isupplyparts.com.

Additional Information
Type

Upper Layer (Without NAND), Lower Layer - US Version, Lower Layer - EU Version