LUOWEI IP 0.12mm iPhone CPU Reballing Stencil

 The LUOWEI IP 0.12mm Reballing Stencil is designed for high-precision iPhone CPU reballing. With an ultra-thin 0.12mm thickness, it ensures fast heating, even tin flow, and accurate solder ball placement. Built from high-quality stainless steel, the stencil maintains stability under high temperatures, making it ideal for professional motherboard repair.

Features

• Ultra-thin 0.12mm design — heats quickly and supports smooth solder flow.
• High-precision hole layout — ensures accurate and consistent CPU reballing results.
• Heat-resistant stainless steel — durable and warp-resistant under repeated high-temperature use.
• Tight fit for iPhone CPU chips — reduces tin overflow and improves success rate.
• Suitable for both hot air and reflow platforms.

Applications

• iPhone CPU reballing and rework.
• Motherboard repair and chip-level servicing.
• Removing, cleaning, and reballing IC chips during refurbishment.
• Ideal for repair shops, refurbishing centers, and advanced technicians.

Hassle-free contact

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