Description
The LUOWEI Kirin 0.12mm CPU Reballing Stencil is designed specifically for precise reballing of Huawei Kirin processors. With an ultra-thin 0.12mm profile, it provides fast and even heating for smooth tin flow and accurate solder ball placement. Made from high-quality stainless steel, it offers excellent durability and temperature resistance—ideal for professional chip-level repair work.
Features
- 0.12mm ultra-thin thickness for rapid heat transfer and efficient reballing.
- High-precision hole layout ensures accurate alignment for Kirin CPU chips.
- Heat-resistant stainless steel prevents warping under high temperatures.
- Stable structure improves solder ball uniformity and success rate.
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Suitable for both hot air and reflow machines.
Applications
- Reballing and rework of Huawei Kirin processors.
- Chip-level motherboard repair and IC servicing.
- Removing, cleaning, and reballing Kirin CPU chips.
- Ideal for professional repair shops, refurbishing centers, and advanced technicians.
Hassle-free contact
We're here to help! Contact us at sales@isupplyparts.com
Additional Information
| Kirin CPU Reball Stencil |
HiU-1, HiU-2, HiU Set |
|---|
LUOWEI Kirin 0.12mm CPU Reballing Stencil
$1.98