Mijing iRepair MS1 Desoldering Platform With Moulds from iPhone X-16 Pro Max

The Mijing iRepair MS1 Desoldering Platform with Moulds is a specialized tool designed primarily for the separation and recombination of mobile phone motherboards. It provides precision and stability, making it an essential tool for professionals involved in complex mobile phone repairs. The platform includes various moulds that securely hold the motherboard during the separation or recombination process, ensuring accuracy and reducing the risk of damage.  

Suitable for

• iPhone X/ XS / XS Max / 11 Pro / 11 Pro Max
• iPhone 12 Series
• iPhone 13 Series
• iPhone 14 Series
• iPhone 15 Series
• iPhone 16 Series

Main Features:

1. Precision and Stability: The platform securely holds the motherboard, minimizing movement and ensuring precise separation and recombination.
2. Multiple Moulds Included: Comes with a variety of moulds compatible with different motherboard sizes, offering versatility for various mobile phone models.
3. Heat-Resistant Construction: Made from durable, heat-resistant materials, it can withstand the high temperatures necessary for motherboard separation.
4. User-Friendly Design: Easy to set up and use, with a compact and ergonomic design that fits conveniently on any workbench.
5. Versatility: Suitable for a wide range of mobile phone motherboards, making it a versatile tool in electronics repair.

Use Guide:

1. Setup: Place the Mijing iRepair MS1 platform on a stable, flat surface.
2. Select the Appropriate Mould: Choose the mould that matches the size of the motherboard you need to work on. Insert the mould into the platform.
3. Position the Motherboard: Secure the motherboard in the mould, ensuring it is held firmly and accurately aligned.
4. Separating the Motherboard: Apply heat using a heat gun or other tools to soften the adhesive or solder. The platform will hold the motherboard steady during this process.
5. Recombining the Motherboard: After repairs, use the same platform to assist in accurately realigning and recombining the motherboard layers.
6. Finishing Touches: Ensure all connections are secure and that the motherboard is properly reassembled before removing it from the platform.

Product Specifications

Package Size: 220 * 158 * 50mm