The QUICK 857 Pro Rework Station is a professional hot air rework station designed for mobile phone motherboard repair, PCB rework, IC chip removal, SMD component replacement, and precision electronics repair.
Featuring a powerful hot air heating system, precise temperature control, and stable airflow, the QUICK 857 Pro provides efficient and controlled heating for demanding motherboard repair applications.
It is suitable for smartphone motherboard repair, IC chip removal and replacement, SMD component rework, connector removal, soldering and desoldering, and other precision PCB repair tasks, making it a practical choice for professional mobile phone repair shops, motherboard repair technicians, and electronics engineers.
Key Features
| Feature Description | |
|---|---|
| Powerful Hot Air Heating | Provides strong and stable hot air for efficient IC and component removal |
| Precise Temperature Control | Adjustable temperature helps technicians achieve consistent heating during different repair operations |
| Stable Airflow | Provides controlled and stable airflow for precise motherboard rework |
| Fast Heating Performance | Quickly reaches the required working temperature to improve repair efficiency |
| Professional Pro Design | Designed for demanding mobile phone motherboard, PCB, IC, and SMD rework applications |
| Adjustable Heating Parameters | Allows technicians to select suitable temperature and airflow according to different components |
| Precision Component Rework | Suitable for small ICs, SMD components, connectors, and other motherboard components |
| Efficient Rework Operation | Helps improve efficiency during frequent chip removal and component replacement |
| Wide Application Range | Suitable for IC removal, SMD rework, connector removal, soldering, and desoldering |
| Professional Workstation | Ideal for professional repair shops and electronics repair workbenches |
Applications
The QUICK 857 Pro Rework Station is suitable for:
- iPhone motherboard repair
- Android smartphone motherboard repair
- IC chip removal and replacement
- SMD component soldering and desoldering
- PCB repair and rework
- Charging IC repair
- CPU and NAND repair preparation
- Connector removal and replacement
- Shield removal
- Small component rework
- Chip-level motherboard repair
- General electronics repair
Product Specifications
| Specification Details | |
|---|---|
| Brand | QUICK |
| Model | 857 Pro |
| Product Type | Hot Air Rework Station |
| Temperature Control | Adjustable |
| Airflow Control | Adjustable |
| Heating System | Hot Air Heating |
| Heating Type | Hot Air Rework |
| Suitable For | PCB / IC / SMD / BGA Rework |
| Application | Mobile Phone Motherboard Repair |
Repair Notes
- Select the appropriate temperature and airflow according to the motherboard and component being repaired.
- Apply suitable flux before removing IC chips or other motherboard components.
- Use an appropriate hot air nozzle according to the size and position of the component.
- Avoid excessive temperature or prolonged heating to prevent PCB, component, or pad damage.
- Preheat the motherboard when necessary to reduce thermal stress during chip removal.
- Keep the hot air nozzle at an appropriate distance from the PCB and avoid concentrating heat on one area for too long.
- Monitor the heating process carefully, especially when working with multilayer smartphone motherboards.
- Allow the equipment to cool properly after completing the repair operation.
Hassle-free Contact
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