The QUICK 861 Pro Max Intelligent Hot Air Rework Station is a professional hot air repair tool designed for mobile phone motherboard repair, PCB rework, SMD component removal, IC chip replacement, and precision chip-level repair.
Equipped with a high-performance heating system, precise temperature control, adjustable airflow, and intelligent temperature management, the QUICK 861 Pro Max provides fast, stable, and reliable heating performance for professional repair technicians.
Its powerful hot air output and flexible temperature and airflow adjustment make it suitable for smartphone motherboard repair, IC chip removal and replacement, SMD component rework, BGA work, and electronic circuit repair, making it an excellent choice for mobile phone repair shops and motherboard repair engineers.
Key Features
| Feature Description | |
|---|---|
| High-Power Heating | Powerful heating system provides fast heat-up and efficient desoldering for demanding motherboard repair applications |
| Precise Temperature Control | Accurate temperature adjustment helps provide stable heating and better protection for sensitive electronic components |
| Adjustable Airflow | Flexible airflow control allows technicians to adapt the hot air output to different IC, SMD, and PCB repair tasks |
| Intelligent Temperature Management | Intelligent control helps maintain stable working temperature during continuous repair operations |
| Digital Display | Clear digital display allows easy monitoring of temperature and operating parameters |
| Fast Heat-Up | Rapid heating helps improve work efficiency during frequent chip removal and component replacement |
| Professional Hot Air Handle | Ergonomic handle design provides comfortable operation during precision motherboard repair |
| Professional Design | Compact and practical workstation design is suitable for professional repair shops and electronics workbenches |
Applications
The QUICK 861 Pro Max Intelligent Hot Air Rework Station is suitable for:
- iPhone motherboard repair
- Android smartphone motherboard repair
- IC chip removal and replacement
- BGA rework
- SMD component soldering and desoldering
- PCB repair and rework
- Charging IC repair
- CPU and NAND repair preparation
- Connector removal
- Shield removal
- Chip-level motherboard repair
Product Specifications
| Specification Details | |
|---|---|
| Brand | QUICK |
| Model | 861 Pro Max |
| Product Type | Intelligent Hot Air Rework Station |
| Temperature Control | Adjustable |
| Airflow Control | Adjustable |
| Display | Digital Display |
| Heating Type | Hot Air Heating |
| Suitable For | SMD / PCB / IC / BGA Rework |
| Application | Mobile Phone Motherboard Repair |
Repair Notes
- Select the appropriate temperature and airflow according to the component and motherboard being repaired.
- Apply suitable flux before removing IC chips or other motherboard components.
- Choose the correct hot air nozzle size to concentrate heat on the repair area.
- Avoid excessive temperature or prolonged heating to prevent PCB, component, or pad damage.
- Adjust airflow carefully when working with small SMD components to prevent components from being blown away.
- Preheating the motherboard when necessary can help reduce thermal stress during chip removal.
- Allow the hot air station to complete its cooling process before switching off the power.
Hassle-free Contact
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