The QUICK 861Pro Smart Hot Air Desoldering Station is a professional hot air rework tool designed for mobile phone motherboard repair, PCB rework, SMD component removal, IC chip replacement, and precision electronics repair.
Featuring a high-performance heating system, precise temperature control, adjustable airflow, and intelligent temperature management, the QUICK 861Pro provides stable and efficient hot air performance for professional repair technicians.
With its compact design and flexible heating control, the 861Pro is suitable for smartphone motherboard repair, IC and SMD component desoldering, BGA rework, connector removal, and PCB repair, making it a practical choice for mobile phone repair shops and electronics repair workbenches.
Key Features
| Feature Description | |
|---|---|
| Fast Heating | High-performance heating system provides rapid heat-up and efficient desoldering |
| Precise Temperature Control | Accurate temperature adjustment helps provide stable heating for sensitive electronic components |
| Adjustable Airflow | Flexible airflow control allows adjustment for different IC, SMD, and PCB repair applications |
| Intelligent Temperature Management | Intelligent control helps maintain stable working temperature during repair operations |
| Digital Display | Clear display allows technicians to monitor and adjust operating parameters easily |
| Smart Operation | Intelligent operating functions improve convenience and work efficiency during repeated repair tasks |
| Ergonomic Hot Air Handle | Comfortable handle design provides better control during precision desoldering |
| Compact Professional Design | Space-saving design is suitable for mobile phone repair shops and electronics workbenches |
Applications
The QUICK 861Pro Smart Hot Air Desoldering Station is suitable for:
- iPhone motherboard repair
- Android smartphone motherboard repair
- IC chip removal and replacement
- BGA rework
- SMD component soldering and desoldering
- PCB repair and rework
- Charging IC repair
- CPU and NAND repair preparation
- Connector removal
- Shield removal
- Chip-level motherboard repair
Product Specifications
| Specification Details | |
|---|---|
| Brand | QUICK |
| Model | 861Pro |
| Product Type | Smart Hot Air Desoldering Station |
| Temperature Control | Adjustable |
| Airflow Control | Adjustable |
| Display | Digital Display |
| Heating Type | Hot Air Heating |
| Suitable For | SMD / PCB / IC / BGA Rework |
| Application | Mobile Phone Motherboard Repair |
Repair Notes
- Select the appropriate temperature and airflow according to the component and motherboard being repaired.
- Apply suitable flux before removing IC chips or other motherboard components.
- Choose the correct nozzle size to concentrate hot air on the repair area.
- Avoid excessive temperature or prolonged heating to prevent PCB, component, or pad damage.
- Use lower airflow when working with small SMD components to prevent components from being displaced.
- Preheat the motherboard when necessary to reduce thermal stress during chip removal.
- Allow the station to complete its cooling process before switching off the power.
Hassle-free Contact
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