The QUICK 858D+ Lead-Free Hot Air Desoldering Station is a professional hot air rework station designed for mobile phone motherboard repair, PCB rework, IC chip removal, SMD component replacement, and precision electronics repair.
Designed to support lead-free soldering and desoldering applications, the QUICK 858D+ provides adjustable temperature and airflow control for efficient and controlled heating. Its compact design makes it suitable for both professional repair workbenches and general electronics repair applications.
It is ideal for smartphone motherboard repair, IC chip removal and replacement, SMD component rework, connector removal, soldering and desoldering, and other PCB repair tasks, making it a practical choice for mobile phone repair technicians, electronics engineers, and professional repair shops.
Key Features
| Feature Description | |
|---|---|
| Lead-Free Rework Support | Designed for lead-free soldering and desoldering applications |
| Adjustable Temperature Control | Allows technicians to select a suitable temperature for different components and repair tasks |
| Adjustable Airflow | Provides controlled airflow for precise heating during component removal and rework |
| Fast Heating Performance | Quickly provides hot air to improve repair efficiency |
| Stable Heating | Delivers consistent and controlled hot air for reliable rework operations |
| Precision Rework | Suitable for ICs, SMD components, connectors, and other PCB components |
| Compact Design | Space-saving design is suitable for professional repair workbenches |
| Wide Application Range | Suitable for mobile phone, PCB, IC, SMD, and general electronics repair |
| Professional Rework Tool | Designed for frequent component removal, replacement, and PCB rework |
Applications
The QUICK 858D+ Lead-Free Hot Air Desoldering Station is suitable for:
- iPhone motherboard repair
- Android smartphone motherboard repair
- Lead-free solder desoldering
- IC chip removal and replacement
- SMD component soldering and desoldering
- PCB repair and rework
- Charging IC repair
- Connector removal and replacement
- Shield removal
- Small component rework
- Chip-level motherboard repair
- General electronics repair
Product Specifications
| Specification Details | |
|---|---|
| Brand | QUICK |
| Model | 858D+ |
| Product Type | Hot Air Desoldering Station |
| Temperature Control | Adjustable |
| Airflow Control | Adjustable |
| Heating System | Hot Air Heating |
| Heating Type | Hot Air Rework |
| Solder Type | Lead-Free Solder Compatible |
| Suitable For | PCB / IC / SMD Rework |
| Application | Mobile Phone Motherboard Repair |
Repair Notes
- Select the appropriate temperature and airflow according to the motherboard and component being repaired.
- Use a suitable hot air nozzle according to the size and position of the component.
- Apply appropriate flux when necessary before removing IC chips or other motherboard components.
- When working with lead-free solder, select suitable heating parameters according to the solder and PCB design.
- Avoid excessive temperature or prolonged heating to prevent PCB, component, or pad damage.
- Keep the hot air nozzle at an appropriate distance from the PCB and avoid concentrating heat on one area for too long.
- Preheat the motherboard when necessary to reduce thermal stress during chip removal.
- Monitor the heating process carefully, especially when working with multilayer smartphone motherboards.
- Allow the equipment to cool properly after completing the repair operation.
Hassle-free Contact
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