XZZ (XinZhiZao) Motherboard Middle Frame Layer Reballing Universal Platform and Stencil Set

$58.75

Options: Whole Set (Universal Platform + IPX-16 Pro Max)

Whole Set (Universal Platform + IPX-16 Pro Max)
Universal Platform
Stencil Platform (X-11 Pro Max)
Stencil Platform (12 Series)
Stencil Platform (13 Series)
Stencil Platform (14 Series)
Stencil Platform (15 Series)
Stencil Platform (16 Series)
Stencil Platform (17 Series)
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Description

The XZZ (XinZhiZao) Middle Frame Layer Reballing Universal Platform and Stencil Set is a precision-engineered fixture designed for reballing the middle-layer motherboard of iPhone X to iPhone 16 series. With a stable clamping structure and high-accuracy stencils, this tool provides a reliable and efficient solution for technicians performing multilayer logic board repairs, chip reballing, and pad reshaping.

 

Features

  • Universal Compatibility
    Supports iPhone X to 17 Series middle-frame motherboard layers with precise alignment.
  • High-Accuracy Stencils
    CNC-crafted stainless steel stencils deliver consistent paste deposition and reliable reballing results.
  • Secure Locking Platform
    Anti-slip fixture ensures the board stays firmly in position during soldering and heating.
  • High-Temperature Resistant Body
    Durable construction withstands hot air and reflow temperatures without deformation.
  • Professional-Grade Precision
    Designed for microsoldering shops, refurbishment centers, and advanced technicians.
  • Improved Workflow Efficiency
    Makes middle-layer chip repair, pad cleaning, and stencil reballing faster and easier.


Use Scenarios

  • Middle-Layer Motherboard Reballing
    For iPhone X–16 series multilayer logic boards.
  • IC Reballing & Reflow Work
    Ideal for CPU, PMIC, baseband, and small SMD components.
  • Pad Refinishing & Micro BGA Repairs
    Supports cleaning, flux application, and uniform solder ball placement.
  • Training and Professional Microsoldering
    Suitable for repair labs, training centers, and refurbishment factories.
  • Logic Board Separation / Rebuild Projects
    Assists during board separation, re-alignment, and reassembly processes.

 

Specifications

  • Brand: XZZ (XinZhiZao)
  • Model: Middle Frame Layer Universal Reballing Platform
  • Compatibility: iPhone X to iPhone 17 series
  • Material: High-temperature resistant alloy + stainless steel stencils
  • Function: Motherboard holding, reballing support, stencil alignment
  • Included: Universal platform + corresponding stencil set
  • Application: Mobile phone motherboard repair & microelectronics reballing


Hassle-free contact

We're here to help! Contact us at sales@isupplyparts.com

 

 

Additional Information
Options

Whole Set (Universal Platform + IPX-16 Pro Max), Universal Platform, Stencil Platform (X-11 Pro Max), Stencil Platform (12 Series), Stencil Platform (13 Series), Stencil Platform (14 Series), Stencil Platform (15 Series), Stencil Platform (16 Series), Stencil Platform (17 Series)