Amaoe 0.12mm BGA Reball Stencil for iPhone
The Amaoe 0.12mm BGA Reball Stencil is an essential tool for professional iPhone repair technicians. Designed with precision and durability in mind, this stencil is tailored specifically for iPhone logic board chip reballing, ensuring reliable and accurate results every time. Key Features:
- High-Precision Design: Engineered with 0.12mm ultra-thin stainless steel for precise solder paste application and chip alignment.
- Wide Compatibility: Specifically designed for various iPhone models, making it a versatile addition to your repair toolkit.
- Durable Material: Crafted from high-quality materials to withstand repeated use and high temperatures during soldering.
- Easy to Use: The ergonomic design allows for quick and efficient reballing, saving time and reducing the risk of errors.
- Professional Results: Achieve clean and consistent solder joints, restoring iPhones to optimal performance.
Suitable for
- iPhone 6/6 Plus
- iPhone 6S/6S Plus
- iPhone 7/7 Plus
- iPhone 8/8 Plus/X
- iPhone XS/XS Max/XR
- iPhone 11/11 Pro/11 Pro Max
- iPhone 12 Mini/12/12 Pro/12 Pro Max
- iPhone 13 Mini/13/13 Pro/13 Pro Max
- iPhone 14/14 Plus/14 Pro/14 Pro Max
- iPhone 15/15 Plus/15 Pro/15 Pro Max
- iPhone 16/16 Plus/16 Pro/16 Pro Max
- iPhone 17/17 Pro/17 Pro Max/Air
This reball stencil is a must-have for repair professionals who demand accuracy and efficiency. Whether you're working on board-level repairs or advanced chip reballing, the Amaoe 0.12mm BGA Reball Stencil ensures your repairs meet the highest standards.
After-Sale Service:
For inquiries or assistance, contact us anytime at: sales@isupplyparts.com
| Model |
6-17 Pro Max, 6/6P, 6S/SP, 7/7P, 8/8P/X, XS/XS Max/XR, 11/11 Pro/11 Pro Max, 12 Mini/12/12 Pro/12 Pro Max, 13 Mini/13/13 Pro/13 Pro Max, 14/14 Plus/14 Pro/14 Pro Max, 15/15 Plus/15 Pro/15 Pro Max, 16/16 Plus/16 Pro/16 Pro Max, 17/17 Pro/17 Pro Max/Air |
|---|
