The 2UUL BH13 MidReball Base is a versatile 5-in-1 reballing platform designed specifically for iPhone 12 to 16 Pro Max series mid-layer boards. It provides precise alignment, stable positioning, and...

Reballing the CPU chip of iPhone and Android devices.

Amaoe 0.12mm BGA Reball Stencil for iPhone The Amaoe 0.12mm BGA Reball Stencil is an essential tool for professional iPhone repair technicians. Designed with precision and durability in mind, this...

The LUOWEI 0.12mm MTK CPU Reballing Stencil is engineered for precise reballing work on MediaTek (MTK) processors. Its ultra-thin 0.12mm design provides faster heating and smoother tin flow, ensuring accurate...

 The LUOWEI IP 0.12mm Reballing Stencil is designed for high-precision iPhone CPU reballing. With an ultra-thin 0.12mm thickness, it ensures fast heating, even tin flow, and accurate solder ball placement....

The LUOWEI Kirin 0.12mm CPU Reballing Stencil is designed specifically for precise reballing of Huawei Kirin processors. With an ultra-thin 0.12mm profile, it provides fast and even heating for smooth...

The LUOWEI Qualcomm 0.12mm CPU Reballing Stencil is engineered for precise and efficient reballing of Qualcomm processors. Its ultra-thin 0.12mm thickness allows rapid, even heating for smooth solder flow and...

MiJing MJ Z21 Max CPU Reballing Stencil with Magnetic Platform The MiJing MJ Z21 Max CPU Reballing Stencil is a premium tool designed to streamline and enhance the efficiency of...

For more working space and a wider view.