Description
The LUOWEI Qualcomm 0.12mm CPU Reballing Stencil is engineered for precise and efficient reballing of Qualcomm processors. Its ultra-thin 0.12mm thickness allows rapid, even heating for smooth solder flow and accurate ball placement. Built from durable, heat-resistant stainless steel, it ensures stability during high-temperature operations, making it a reliable tool for professional motherboard repairs.
Features
- Ultra-thin 0.12mm design enables fast heating and consistent tin reflow.
- Precision hole alignment ensures accurate positioning for Qualcomm CPUs.
- High-strength stainless steel resists deformation under repeated heat cycles.
- Stable structure enhances reballing accuracy and success rate.
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Compatible with hot air guns and reflow stations.
Applications
- Reballing and reworking of Qualcomm processors.
- Chip-level IC repair and motherboard servicing.
- Cleaning, tin-pasting, and reballing CPU chips.
- Suitable for repair labs, refurbishing factories, and advanced technicians.
Hassle-free contact
We're here to help! Contact us at sales@isupplyparts.com
Additional Information
| Qualcomm CPU Reball Stencil |
SD-1, SD-2, SD-3, SD-4, SD-5, SD Set |
|---|
LUOWEI Qualcomm 0.12mm CPU Reballing Stencil
$1.98