2UUL BH31 The Smile JIG for Phone Board & Chip This professional fixture is designed for mobile phone motherboard and chip repair. Adopting classic smile-shaped structure, it firmly clamps circuit...

2UUL BH30 The Smile JIG Mini for Phone Board & Chip This mini positioning fixture is specially developed for mobile phone mainboard and chip repair. With ergonomic smile-shaped design, it...

2UUL & MiJing BH01 OX JIG Universal Phone PCB Board Holder The 2UUL & MiJing BH01 OX JIG Universal Phone PCB Board Holder is a specialized tool designed for securely...

The SUNSHINE 210 Pro is a smart, portable soldering iron designed for precision electronics repair on the go.

Reballing the CPU chip of iPhone and Android devices.

an essential tool for chip BGA reballing and motherboard repair.

The Mijing Non-Magnetic Scraper is a precision tool designed specifically for BGA chip reballing and microsoldering tasks. Its non-magnetic construction prevents solder balls, metal filings, and fine components from sticking...

For more working space and a wider view.

The iSP selected hot air gun, suitable for chip-level motherboard repair

SUGON 8650 Hot Air Gun 2024 Version features rapid heating, precise airflow control, and stable performance for professional phone repair.

The LUOWEI Kirin 0.12mm CPU Reballing Stencil is designed specifically for precise reballing of Huawei Kirin processors. With an ultra-thin 0.12mm profile, it provides fast and even heating for smooth...

The LUOWEI Qualcomm 0.12mm CPU Reballing Stencil is engineered for precise and efficient reballing of Qualcomm processors. Its ultra-thin 0.12mm thickness allows rapid, even heating for smooth solder flow and...